PC-ABS: a polycarbonate/ABS blend — density, temperature, when to choose it
PC-ABS is a blend of polycarbonate and ABS, used when plain ABS isn't heat-resistant enough and plain PC is too fussy and brittle on impact at low temperatures. A classic of the automotive and electronics industries — often used for housings and functional prototypes.
Key properties
| Parameter | Value |
|---|---|
| Density | 1.15–1.20 g/cm³ |
| Nozzle temperature | 250–270°C |
| Bed temperature | 90–110°C |
| Part cooling | minimal or off |
| Shrinkage | noticeable, requires an enclosure |
| Enclosure required | yes, mandatory |
When to use it
- Electronics housings and parts that run warm (near a motor, in a car in summer).
- Functional prototypes that need both ABS's impact resistance and higher heat resistance than it offers.
- Replacing plain PC where impact ductility matters more than maximum service temperature.
When to pick something else
- A budget printer without an enclosure and 90°C+ bed heating — the print is likely to delaminate and crack; take ABS or PETG instead.
- You need maximum heat resistance (above 110–120°C) — you need plain PC or PEEK.
- A one-off print without access to ventilation — printing releases styrene vapors, like ABS, and needs room ventilation.
Pros and cons
Pros: ABS-level impact resistance plus higher heat resistance than plain ABS; holds threaded joints and snap-fits well; less prone to brittle failure in the cold than plain PC.
Cons: an enclosure and 90°C+ bed are mandatory — unavailable on most budget printers; noticeable shrinkage and odor while printing; more expensive than ABS.
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The long bed warm-up to 90–110°C and enclosure operation noticeably increase energy use per print cycle compared to PLA/PETG. The filament itself costs more than ABS, but noticeably less than engineering-grade PC or PEEK — a reasonable middle ground when the customer genuinely needs higher heat resistance, not just "make it tougher."